Superconducting and isothermal heat-dissipation module

ABSTRACT

The present invention provides a superconducting and isothermal heat-dissipation module meeting the heat-dissipation demand for different heating elements. The superconducting and isothermal heat-dissipation module of the present invention includes a heat-conducting isothermal plate and a frame made according to the contour of the heating element. The heat-conducting isothermal plate has an upper and a lower covers, and plural pillar partition pieces served as support bodies, which are uprightly provided between the upper and the lower covers and is closely contacted with the inner faces of the upper and a lower covers. A cavity for filling a heat transfer medium is formed by sealing the upper, lower covers and the pillar partition pieces. The frame is provided with one or several insertion hole(s) for the insertion of said heat-conducting isothermal plate therein for mutual integration.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a superconducting and isothermal heat-dissipation module, and more particularly to a superconducting and isothermal heat-dissipation module, which conducts heat dissipation in a modular fashion.

2. Brief Description of the Prior Art

Accompanying with the booming development of the semiconductor industry in recent years, consumer electronics products are apt to become light-weighted, thin, short and small, and their functions are also diversified. How to quickly and effectively remove the concentrated high heat generated inside the consumer electronics products in a timely manner is a critical issue apparently concerned with the lifespan, reliability and stability of the products. Nowadays, isothermal plate having high efficiency in heat transfer and isothermal property is widely utilized by the associated industries.

It is known by the industries that an isothermal plate quickly transfers local high heat by utilizing the principle of cyclic phase change of water and vapor so as to achieve isothermal effect on a predetermined area. However, in the conventional method of making isothermal plate according to the demand of heat dissipation of a heating element (T), there exists the problem that hardly prevails in the market due to extremely high manufacturing cost thereof.

SUMMARY OF THE INVENTION

In view of the aforementioned drawback, the inventors of the present invention proposes a new technology which can orient a high-efficiency isothermal plate produced from a single production line to the outer surface of a heating element and the position of a heat source for effective arrangement, so as to be applied widely in the industries concerned with electronics, personal computer and lighting.

The main object of the present invention is to provide a superconducting and isothermal heat-dissipation module in which one or several isothermal plate(s) produced from a single production line is (are) inserted into a frame having insertion holes formed beforehand according to the contour of the heating element or the position of the heat source, and then is (are) combined with the heating element so as to perform heat conduction of single or multiple point(s) of heat source(s) and to achieve uniform temperature effect.

In order to achieve the aforementioned object, the present invention provides a superconducting and isothermal heat-dissipation module formed by a heat-conducting isothermal plate (A) and a frame (B) made according to the contour of the heating element (T), wherein the heat-conducting isothermal plate (A) includes an upper and a lower covers (1,2), and pillar partition pieces (3) serving as support bodies which is uprightly provided between the upper and the lower covers (1,2) and is closely contacted with inner faces (1 a,2 a) of the upper and the lower covers (1,2), a cavity for filling a heat transfer medium formed by sealing the upper, lower covers (1,2) and the pillar partition pieces (3), and the frame (B) is provided with one or several insertion holes (4) for the insertion of the heat-conducting isothermal plate (A) therein in formation of an integral body.

In the superconducting and isothermal heat-dissipation module of the present invention, the upper and the lower covers (1, 2) are of circular, square or irregular shape.

In the superconducting and isothermal heat-dissipation module of the present invention, the pillar partition pieces are arranged annularly and separately with equal distance therebetween.

In the superconducting and isothermal heat-dissipation module of the present invention, the mutually abutted inner faces (1 a, 2 a) of the upper, lower covers (1, 2) and the pillar partition piece (3) have capillary structure formed by the metal sintering process of copper powder.

Furthermore, the superconducting and isothermal heat-dissipation module of the present invention is formed by a heat-conducting isothermal plate (A) and a frame (B) made according to the contour of the heating element (T), wherein the heat-conducting isothermal plate (A) includes an upper and a lower covers (1,2), and pillar partition pieces (3) serving as support bodies which is uprightly provided between the upper and the lower covers (1,2) and is closely contacted with inner faces (1 a,2 a) of the upper, lower covers (1,2), the mutually abutted inner faces (1 a, 2 a) of the upper and the lower cover (1, 2) and the pillar partition piece (3) have capillary structure formed by the metal sintering process of copper powder, a cavity for filling a heat transfer medium formed by sealing the upper and the lower covers (1,2) and the pillar partition piece (3), the frame (B) is provided with one or several insertion holes (4) for the insertion of said heat-conducting isothermal plate (A) therein in formation of an integral body.

Furthermore, in the superconducting and isothermal heat-dissipation module of the present invention, one or several heat-conducting isothermal plate(s) (A) is (are) inserted and combined into the frame (B) according to the position, size or shape of the heat source (S) of the heating element (T).

Furthermore, in the superconducting and isothermal heat-dissipation module of the present invention, the outer surfaces of the upper and the lower covers (1,2) of the heat-conducting isothermal plate (A) are applied with a flattening treatment, such as polishing, to lower the thermal resistance.

Furthermore, in the superconducting and isothermal heat-dissipation module of the present invention, the frame (B) is made from heat-resistant resin, silicon grease for heat dissipation, phase change rubber sheet, or material having low thermal resistance coefficient, such as aluminum.

Furthermore, in the superconducting and isothermal heat-dissipation module of the present invention, the insertion holes (4) of said frame (B) are blind holes (4 a) or through holes (4 b) with positioning taper (Bt) on the inner wall.

Additionally, in the superconducting and isothermal heat-dissipation module of the present invention, the frame (B) can be formed with fins (F) having heat dissipation function.

Furthermore, the superconducting and isothermal heat-dissipation module of the present invention is further provided with secondary heat dissipation device such as fins (F), fan or coolant.

BRIEF DESCRIPTION OF THE ACCOMPANYING DRAWINGS

FIG. 1 is a schematic view showing the structure of the heat-conducting isothermal plate of the present invention;

FIGS. 2 a and 2 b are schematic views showing the heating element and the corresponding frame of the present invention;

FIG. 3 is an assembly diagram showing the superconducting and isothermal heat-dissipation module and the heating element of the present invention;

FIG. 4 is another assembly diagram showing the superconducting and isothermal heat-dissipation module and the heating element of the present invention; and

FIG. 5 is a schematic view showing the operation of the heat-conducting isothermal plate.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

The technical features of the present invention will become more apparent by the detailed description of the following preferred embodiments of the present invention in conjunction with the accompanied drawings.

Embodiment 1

Firstly, the superconducting and isothermal heat-dissipation module of the present invention will be described.

As shown in FIG. 1, the superconducting and isothermal heat-dissipation module is formed by a heat-conducting isothermal plate (A) and a frame (B) made according to the contour of the heating element (T). The heat-conducting isothermal plate (A) includes an upper and a lower covers (1,2), and pillar partition pieces (3) serving as support bodies which are uprightly provided between the upper and a lower covers (1,2) and are closely contacted with the inner faces (1 a, 2 a) of the upper and the lower covers (1,2). The mutually abutted inner faces (1 a, 2 a) of the upper, lower cover (1, 2) and the pillar partition piece (3) have capillary structure formed by the metal sintering process of copper powder. A cavity for filling a heat transfer medium is formed by sealing the upper, lower covers (1,2) and the pillar partition piece (3). Then, evacuation process is conducted in the cavity through a feed tube (not shown) formed on the upper and the lower covers (1, 2). After filling the heat transfer medium such as water or alcohol, sealing process is conducted to form a heat-conducting isothermal plate that can diffuse spot heat quickly.

Next, a frame (B) is made according to the contour of the heating element (T) and the position of the heat source (S). The heating element (T) specified herein is a rectangular frame body, and it includes 5 heat s (S) arranged in two rows that are mutually intersected and in parallel (refer to FIG. 2 a).

A rectangular aluminum plate (size: L×W) having low thermal resistance is selected according to the contour size of the heating element (T), and five countersunk holes are provided by a machine center at appropriate positions of the surface of the aluminum plate corresponding to the positions of the heat sources (S) of the heating element (T). Each of five countersunk holes has an inner wall having a taper (Bt) with quick positioning function and the depth of each countersunk hole is approximately that of the heat-conducting isothermal plate (A). In order to save material, the side arranged with only two heat sources (S) is machined in a manner as shown in FIG. 2 b by the proportional relationship corresponding to the W1 and L1 between the three heat sources (S) and the aluminum plate (refer to FIG. 2 b).

Next, the five heat-conducting isothermal plates (A) are respectively inserted into the countersunk holes and are closely contacted with the inner wall taper (Bt) of the countersunk holes to form an integral superconducting and isothermal heat-dissipation module. Then, a flattening treatment (for example, polishing) is applied on the contact surface of the assembled superconducting and isothermal heat-dissipation module intended to be adhered to the heating element (T), so as to lower the thermal resistance of the surface of the heat-conducting isothermal plate (A) and more rapidly achieve uniform temperature effect of the surface. The whole contact surface of the superconducting and isothermal heat-dissipation module is applied with heat dissipation grease or the like so that the heat-conducting isothermal plate (A) and the heating element (T) are in a combined state (refer to FIG. 3).

Embodiment 2

Except that the insertion holes of the frame (B) are through holes and the frame (B) has fins, the structure of the embodiment 2 is completely the same as that of the embodiment 1.

In addition, the taper (Bt) of the insertion holes is obtained by chamfering with a drill with larger diameter after a drilling is conducted on the surface of the aluminum plate. Furthermore, the frame (B) can be also made from heat-resistant resin, silicon grease for heat dissipation, or phase change rubber sheet. In the case of heat-resistant resin, injection mold can be made for mass production by injection molding machine.

Similarly, after the superconducting and isothermal heat-dissipation module is formed by the insertion of the heat-conducting isothermal plates (A) into the insertion holes provided on the aluminum plate, a flattening treatment is applied on the contact surface of the superconducting and isothermal heat-dissipation module intended to be adhered to the heating element (T), so as to improve the uniform temperature effect of the isothermal plate (A). Then, the whole contact surface of the superconducting and isothermal heat-dissipation module is applied with heat dissipation grease or the like so that the heat-conducting isothermal plate (A) and the heating element (T) are in a combined state (refer to FIG. 4).

Operation Principle

The operation pattern of the superconducting and isothermal heat-dissipation module of the present invention, when reaching working temperature, will be described as follows.

As shown in FIG. 5, when the heat-conducting isothermal plate (A) reaches the working temperature after the heating element (T) is operated, the two-phase flow circulation of the heat transfer medium within the cavity inside the heat-conducting isothermal plate (A) is started. According to the siphon and capillary phenomena linked with the above two-phase flow circulation of the heat transfer medium, the concentrated heat of the heat sources (S) is guided quickly from the upper cover (1) of the heat-conducting isothermal plate (A) to the lower cover (2) and is dissipated out from the heating element (T). Besides, the free heat remained in the interior space of the heating element (T) can also be transferred to the contacted aluminum plate, and is performed with a secondary heat dissipation (air cooling) together with the heat received by the surface of the aluminum plate contacted on the lower cover (2). In addition, a plurality of fins (F) or other secondary heat dissipation means can be formed on the surface opposite to the contact surface of the superconducting and isothermal heat-dissipation module to conduct a forced heat dissipation.

EFFECT OF THE PRESENT INVENTION

According to the aforementioned structure of the present invention, the eddy phenomenon generated by the two-phase change of the heat transfer medium filled in the cavity of each respective heat-conducting isothermal plate of the superconducting and isothermal heat-dissipation module (s) arranged in one or several location(s) according to the contour of heating element and the position of heat source, allows the concentrated heat source of the heating element forms uniform temperature on the isothermal plate in shorter period of time. Most importantly is that the superconducting and isothermal heat-dissipation module of the present invention can meet the heat dissipation demand of different heating element by inserting the isothermal plate in the superconducting and isothermal heat-dissipation module produced from a single production line. Thus, the manufacturer need change no manufacturing process to meet the heat-dissipation demand for different heating element. Instead, only one production line for producing cost-saving and highly efficient isothermal plate unit is enough. The superconducting and isothermal heat-dissipation module can be finished by the insertion of the completed isothermal plate into the frame formed according to the contour of the heating element and the position of the heat source. The heat-dissipation effect can also be further accelerated through a secondary heat-dissipation device.

UTILITY VALUE FOR INDUSTRY

The superconducting and isothermal heat-dissipation module according to the present invention can be applied widely in the industries concerned with electronics, personal computer and lighting due to the nature of easy modulization.

While the present invention has been described with preferred embodiment in conjunction with the accompanying drawings, the preferred embodiment and the drawings are purely for the convenience of description only, and are not intended to be restrictive of the scope of the present invention. It is noted that various modifications and variations can be made without departing from the spirit of the present invention. In this case, these modifications and variations are considered to be within the scope of the present invention. 

1. A superconducting and isothermal heat-dissipation module, comprising a frame (B) made according to the contour of a heating element (T), wherein said heat-conducting isothermal plate (A) has an upper and a lower covers (1,2), a plurality of pillar partition pieces (3) serving as support bodies uprightly provided between said upper cover (1) and said lower cover (2) and closely contacted with inner faces (1 a,2 a) of said upper and lower covers (1,2), and a cavity for filling a heat transfer medium formed by sealing said upper, lower covers (1,2) and said pillar partition piece (3); and said frame (B) has one or several insertion holes (4) for said heat-conducting isothermal plate (A) to be inserted therein for mutual integration.
 2. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein said upper and lower covers (1,2) take a form selected from a group consisting of circular, square and irregular shapes.
 3. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein said plural pillar partition pieces are arranged annularly and separately with equal distance therebetween.
 4. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein said mutually abutted inner faces (1 a, 2 a) of said upper and lower covers (1, 2) and said pillar partition piece (3) have capillary structure formed by a metal sintering process of copper powder.
 5. A superconducting and isothermal heat-dissipation module, comprising a heat-conducting isothermal plate (A) and a frame (B) made according to the contour of a heating element (T), wherein said heat-conducting isothermal plate (A) has an upper and a lower covers (1,2), a plurality of pillar partition pieces (3) serving as support bodies uprightly provided between said upper cover (1) and said lower cover (2) and closely contacted with inner faces (1 a, 2 a) of said upper and lower covers (1,2), a capillary structure formed on each of mutually abutted inner faces (1 a, 2 a) of said upper and said lower cover (1, 2) respectively and on said pillar partition pieces (3) by a metal sintering process of copper powder, and a cavity for filling a heat transfer medium formed by sealing said upper and lower covers (1, 2) and said pillar partition pieces (3), and said frame (B) has one or several insertion holes (4) for said heat-conducting isothermal plate (A) to be inserted therein for mutual integration.
 6. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein one or several said heat-conducting isothermal plate(s) (A) is (are) inserted and combined with said frame (B) according to the position, size or shape of heat source (8) of said heating element (T).
 7. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein outer surfaces of said upper and lower covers (1,2) of said heat-conducting isothermal plate (A) are applied with a flattening treatment to lower the thermal resistance.
 8. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein said frame (B) is composed of heat-resistant resin, silicon grease for heat dissipation, phase change rubber sheet, or material having low thermal resistance.
 9. A superconducting and isothermal heat-dissipation module as set forth in claim 8, wherein said material having low thermal resistance is aluminum.
 10. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein said insertion holes (4) of said frame (B) are blind holes (4 a) or through holes (4 b) with positioning taper (Bt) on the inner wall.
 11. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein said frame (B) can be formed with fins (F) having heat dissipation function.
 12. A superconducting and isothermal heat-dissipation module as set forth in claim 1, wherein a secondary heat dissipation device selected from a group consisting of fins (F), a fan and coolant is provided.
 13. A superconducting and isothermal heat-dissipation module as set forth in claim 5, wherein one or several said heat-conducting isothermal plate(s) (A) is (are) inserted and combined with said frame (B) according to the position, size or shape of heat source (8) of said heating element (T).
 14. A superconducting and isothermal heat-dissipation module as set forth in claim 5, wherein outer surfaces of said upper and lower covers (1,2) of said heat-conducting isothermal plate (A) are applied with a flattening treatment to lower the thermal resistance.
 15. A superconducting and isothermal heat-dissipation module as set forth in claim 5, wherein said frame (B) is composed of heat-resistant resin, silicon grease for heat dissipation, phase change rubber sheet, or material having low thermal resistance.
 16. A superconducting and isothermal heat-dissipation module as set forth in claim 5, wherein said insertion holes (4) of said frame (B) are blind holes (4 a) or through holes (4 b) with positioning taper (Bt) on the inner wall.
 17. A superconducting and isothermal heat-dissipation module as set forth in claim 5, wherein said frame (B) can be formed with fins (F) having heat dissipation function.
 18. A superconducting and isothermal heat-dissipation module as set forth in claim 5, wherein a secondary heat dissipation device selected from a group consisting of fins (F), a fan and coolant is provided. 